Air Cooling is the most common and widely used methodology for cooling of Electronics packages and systems.
Any industry you think of and you will find Air cooling as the most preferred way for cooling due to its cost effectiveness and simplicity in operation and construction.
Natural Convection and Forced convection are the two most common air cooling methods used across the industry. Depending upon the system constraints and thermal performance requirements a particular method is selected and implemented. This is usually coupled with advancements happening which includes heat pipes, vapor chambers etc. at the heat sink level and required specifications are achieved.
Pankaj Electronics’ Thermal Business Unit is capable of Design and Manufacturing of different types of Air cooled solutions which ranges from simple extrusions to high density wide extrusion profiles used in high heat dissipation applications. Complicated heat sink profiles are handled efficiently with advanced cooling technologies in the required form factor. Our in-depth knowledge of design and manufacturing is helpful in coming up with a reliable and high performance solution which helps in increasing the product life and reliability.